The report contains ten-year analysis with the following sections
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disco corporation | 673 |
iwatani & company | 1 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
semiconductor wafer and method for producing same | 15 | 2008 |
semiconductor device and method of manufacturing the same | 14 | 2009 |
method for manufacturing light-emitting element, and light-emitting element | 13 | 2011 |
method for processing wafer | 12 | 2005 |
laser beam spot shape detecting method | 11 | 2011 |
ablation method for die attach film | 11 | 2011 |
method of dividing wafer into dies | 11 | 2014 |
laser processing method for wafer | 11 | 2011 |
laser processing method | 11 | 2013 |
mark detecting method | 11 | 2014 |