The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
preparation process of image sensor | 4 | 2014 |
manufacturing method of three-dimensional integrated inductor-capacitor structure | 4 | 2014 |
novel process for reducing hillock-shaped defects produced on aluminum film | 4 | 2013 |
semiconductor cooling structure and method in hybrid bonding process | 4 | 2014 |
method for integrating power device and control device | 2 | 2015 |
inductor in three-dimensional stacked packaged chip and preparation method thereof | 2 | 2015 |
chip fixing device and preparation method for invalid analysis sample | 2 | 2015 |
film stripping method for metal barrier layers | 2 | 2013 |
bearing device and preparation method thereof | 2 | 2015 |
sample preparation method capable of quickly obtaining shape of barrier layer | 2 | 2015 |