The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
adhesive layer and adhesive film | 17 | 2014 |
white hardening resin composition | 16 | 2007 |
photosensitive dry film and process for producing printed wiring board using the same | 15 | 2014 |
curable resin composition dry film cured product and display member | 12 | 2013 |
photosensitive resin composition, cured product thereof, and printed wiring board | 12 | 2009 |
curable composition for printed circuit board, cured coating film using the same, and pr… 🛈 | 11 | 2013 |
photocurable resin composition, dry film and cured object obtained therefrom, and printe… 🛈 | 11 | 2010 |
dry film and printed wiring board | 11 | 2013 |
curable resin composition, composition for solder resist formation, dry film and printed… 🛈 | 11 | 2012 |
photosensitive resin composition, cured film thereof and printed circuit board | 11 | 2011 |