The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
recovery of data from a multi carrier signal | 22 | 2008 |
capacitive discharge circuit for touch sensitive screen | 8 | 2014 |
compensation for variations in a capacitive sense matrix | 7 | 2012 |
trimming of operative parameters in electronic devices based on corrections mappings | 7 | 2006 |
delaying or deterring counterfeiting and/or cloning of a component | 6 | 2011 |
multi-layer via-less thin film resistor | 6 | 2010 |
via-less thin film resistor with a dielectric cap | 6 | 2010 |
lateral connection for a via-less thin film resistor | 6 | 2010 |
semiconductor package with a stiffening member supporting a thermal heat spreader | 6 | 2009 |
supply voltage distribution system with reduced resistance for semiconductor devices | 6 | 2006 |