The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
damping apparatus for reducing vibration of automobile body | 33 | 2006 |
generator and power supply for use therein | 19 | 2003 |
substrate with built-in chip and method for manufacturing substrate with built-in chip | 16 | 2005 |
production method of multilayer printed wiring board and multilayer printed wiring board | 16 | 2007 |
wiring board | 13 | 2013 |
wiring board, semiconductor apparatus and method of manufacturing them | 13 | 2007 |
semiconductor device | 11 | 2008 |
wiring board and electronic component device | 11 | 2008 |
support body, method of manufacturing support body, method of manufacturing wiring board… 🛈 | 11 | 2012 |
method of manufacturing electronic device, and electronic component mounting device | 10 | 2012 |