The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for measuring film thickness distribution | 15 | 2011 |
semiconductor substrate, electrode forming method, and solar cell fabricating method | 14 | 2006 |
wafer polishing method and double side polishing apparatus | 14 | 2008 |
heat treatment method | 14 | 2013 |
method for reclaiming peeled-off wafer | 14 | 2011 |
polishing pad, manufacturing method therefor, and polishing method | 14 | 2009 |
bonded soi wafer manufacturing method | 13 | 2012 |
bonded wafer manufacturing method | 13 | 2010 |
method for manufacturing soi wafer | 13 | 2012 |
method for polishing both surfaces of wafer | 13 | 2012 |