The report contains ten-year analysis with the following sections
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lapis semiconductor company | 11 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
semiconductor chip | 15 | 2010 |
semiconductor device and substrate | 14 | 2007 |
semiconductor device and process for fabricating the same | 12 | 2003 |
semiconductor device and method for manufacturing semiconductor device | 11 | 2010 |
semiconductor device, semiconductor element and substrate | 11 | 2007 |
semiconductor device | 10 | 2008 |
semiconductor device and manufacturing method thereof | 8 | 2007 |
boosting circuit of charge pump type and boosting method | 8 | 2010 |
cof package and tape substrate used in same | 8 | 2007 |
voltage output device having an operational amplifier | 7 | 2010 |