The report contains ten-year analysis with the following sections
contact us for pricing
Check out our sample pages |
Many companies now available
Search to find companies of interest
read summary of their published patent
the company report contains more information
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
bonding wire for semiconductor device | 58 | 2015 |
bonding wire for semiconductor device | 28 | 2015 |
bonding wire for semiconductor device | 26 | 2015 |
semiconductor device bonding wire and wire bonding method | 26 | 2007 |
semiconductor device bonding wire | 24 | 2015 |
bonding wire for semiconductor devices | 20 | 2007 |
bonding wire for semiconductor device | 19 | 2015 |
bonding wire for use with semiconductor devices and method for manufacturing said bondin… 🛈 | 18 | 2014 |
bonding wire for semiconductor device | 17 | 2014 |
copper alloy bonding wire for semiconductor | 16 | 2009 |