The report contains ten-year analysis with the following sections
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iteq corporation | 13 |
iteq (dongguan) corporation | 1 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
circuit board | 6 | 2013 |
a method of inhibition of the growth of algae | 5 | 2007 |
resin composition and application thereof | 4 | 2008 |
prepreg and resin for preparing the same | 4 | 2008 |
halogen-free prepreg and resin for preparing the same | 4 | 2008 |
electromagnetic interference shielding film | 3 | 2014 |
halogen-free epoxy resin composition having low dielectric loss | 3 | 2017 |
varnish, prepreg, and substrate thereof | 2 | 2009 |
halogen-free epoxy resin composition for ic packaging | 2 | 2013 |
halogen-free low expansion epoxy resin composition | 2 | 2013 |