The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
stub minimization using duplicate sets of signal terminals in assemblies without wirebon… 🛈 | 90 | 2011 |
stub minimization for multi-die wirebond assemblies with orthogonal windows | 75 | 2011 |
stub minimization for assemblies without wirebonds to package substrate | 41 | 2011 |
memory module in a package | 38 | 2011 |
co-support system and microelectronic assembly | 27 | 2012 |
method for package-on-package assembly with wire bonds to encapsulation surface | 23 | 2012 |
package-on-package assembly with wire bond vias | 23 | 2011 |
optical interposer | 22 | 2012 |
reduced stress tsv and interposer structures | 20 | 2012 |
integrated circuits protected by substrates with cavities, and methods of manufacture | 17 | 2014 |