The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
multiple contact probes | 13 | 2004 |
method of expanding tester drive and measurement capability | 11 | 2006 |
method and apparatus for testing devices using serially controlled resources | 11 | 2007 |
non-linear vertical leaf spring | 11 | 2011 |
wafer test cassette system | 10 | 2009 |
single support structure probe group with staggered mounting pattern | 10 | 2006 |
automated attaching and detaching of an interchangeable probe head | 10 | 2013 |
testing techniques for through-device vias | 10 | 2010 |
method and apparatus for testing devices using serially controlled intelligent switches | 10 | 2007 |
mechanical decoupling of a probe card assembly to improve thermal response | 10 | 2008 |