The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method and system for a semiconductor device package with a die to interposer wafer firs… 🛈 | 22 | 2012 |
semiconductor device and manufacturing method thereof | 16 | 2012 |
direct-write wafer level chip scale package | 15 | 2002 |
semiconductor device and manufacturing method thereof | 14 | 2014 |
semiconductor package including a top-surface metal layer for implementing circuit featu… 🛈 | 13 | 2002 |
packaging for fingerprint sensors and methods of manufacture | 11 | 2011 |
semiconductor package and fabricating method thereof | 11 | 2013 |
semiconductor package and manufacturing method thereof | 9 | 2015 |
copper pillar sidewall protection | 9 | 2014 |
fingerprint sensor and manufacturing method thereof | 9 | 2015 |