The report contains ten-year analysis with the following sections
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disco abrasive system | 313 |
disco corporation | 193 |
disc company | 4 |
three bond company | 2 |
desco | 1 |
adeka corporation | 1 |
kinzoku giken | 1 |
disco corporation | 11 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for processing wafer | 12 | 2005 |
laser processing method for wafer | 11 | 2011 |
dividing method | 10 | 2010 |
laser processing method | 10 | 2012 |
method of manufacturing device having adhesive film on back-side surface thereof includi… 🛈 | 10 | 2007 |
inside reforming substrate for epitaxial growth; crystal film forming element, device, a… 🛈 | 10 | 2009 |
holding table | 10 | 2012 |
processing waste liquid treating apparatus | 10 | 2008 |
laser processing method | 10 | 2013 |
separating apparatus | 10 | 2013 |