The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
through-substrate via structure and method of manufacture | 34 | 2015 |
imaging systems with clear filter pixels | 24 | 2012 |
ground fault circuit interrupter and method | 22 | 2009 |
semiconductor die singulation method and apparatus | 21 | 2012 |
stacked-chip imaging systems | 20 | 2011 |
switch control circuit and resonant converter including the same | 17 | 2014 |
semiconductor die singulation method | 17 | 2007 |
semiconductor die singulation method | 16 | 2012 |
method for manufacturing a semiconductor component and structure therefor | 16 | 2009 |
image sensors with lateral overflow drains | 15 | 2008 |