The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
chip package and method for forming the same | 30 | 2010 |
chip package and method for forming the same | 22 | 2010 |
chip package and method for forming the same | 21 | 2010 |
chip package | 14 | 2010 |
chip package and fabrication method thereof | 14 | 2011 |
electronic device package and fabrication method thereof | 13 | 2008 |
chip package and fabrication method thereof | 12 | 2010 |
chip package including recess in side edge | 11 | 2014 |
chip package and fabrication method thereof | 11 | 2009 |
chip package structure and manufacturing method thereof | 11 | 2011 |