The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
high-frequency package | 15 | 2015 |
semiconductor integrated circuit | 11 | 2013 |
acoustic wave device structure, integrated structure of power amplifier and acoustic wav… 🛈 | 10 | 2014 |
thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing … 🛈 | 9 | 2016 |
heterojunction bipolar transistor | 9 | 2015 |
compound semiconductor esd protection devices | 8 | 2012 |
multi-gate semiconductor devices | 7 | 2010 |
fabrication method for dicing of semiconductor wafers using laser cutting techniques | 7 | 2010 |
method for fabricating bulk acoustic wave resonator with mass adjustment structure | 7 | 2017 |
structure of a semiconductor chip with substrate via holes and metal bumps and a fabrica… 🛈 | 6 | 2013 |