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stats chippac | 3457 |
chippac | 35 |
stats chippac (shanghai) | 9 |
stats chipac | 4 |
st assembly test services | 3 |
stat chippac | 2 |
stats chippac(shanghai)ltd | 1 |
sheets wager package | 1 |
stars chippac | 1 |
stats chicpac | 1 |
stats chippac | 283 |
chippac | 7 |
sheets wager package | 1 |
st assembly test services | 1 |
stats chicpac | 1 |
stats chipac | 1 |
stats chippac | 91 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
bump-on-lead flip chip interconnection | 53 | 2003 |
through-hole via on saw streets | 40 | 2007 |
semiconductor device and method of forming dual-sided interconnect structures in fo-wlcsp | 33 | 2012 |
semiconductor device and method of forming interconnect structure for encapsulated die h… 🛈 | 29 | 2007 |
semiconductor method and device of forming a fan-out pop device with pwb vertical interc… 🛈 | 19 | 2012 |
semiconductor device and method of forming a vertical interconnect structure for 3-d fo-… 🛈 | 17 | 2008 |
semiconductor device and method of depositing encapsulant along sides and surface edge o… 🛈 | 17 | 2012 |
drop-mold conformable material as an encapsulation for an integrated circuit package sys… 🛈 | 16 | 2007 |
semiconductor device and method of forming reconstituted wafer with larger carrier to ac… 🛈 | 16 | 2011 |
semiconductor device and method of dual-molding die formed on opposite sides of build-up… 🛈 | 15 | 2009 |