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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
power semiconductor module with prestressed auxiliary contact spring | 14 | 2008 |
trennvorrichtung für einen leistungshalbleiter und verfahren zu deren betreiben, leistun… 🛈 | 14 | 2008 |
semiconductor arrangement | 13 | 2009 |
modular liquid-cooled power semiconductor module, and arrangement therewith | 12 | 2012 |
pressure-contact-connected power semiconductor module with hybrid pressure accumulator | 12 | 2009 |
method for producing a frequency converter with cooling device and frequency converter | 12 | 2009 |
leistungshalbleitermodul | 12 | 2008 |
high-performance semiconductor with a connection device and internal auxiliary connectio… 🛈 | 11 | 2009 |
liquid-cooled arrangement having modular power semiconductor modules and at least one ca… 🛈 | 11 | 2012 |
high performance semiconductor module with connected substrate carrier and corresponding… 🛈 | 11 | 2007 |