The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
electronic component module and its manufacturing method | 8 | 2011 |
head assembly, magnetic disk drive apparatus and rotation mechanism | 7 | 2009 |
suspension gimbal designs with better dynamic performances | 7 | 2006 |
memory device, laminated semiconductor substrate and method of manufacturing the same | 6 | 2010 |
apparatus and method of manufacturing laser diode unit utilizing submount bar | 6 | 2012 |
electrical current as probe for modulation at head-disk interface | 6 | 2004 |
head gimbal assembly and hard disk device, and manufacturing methods thereof | 6 | 2009 |
piezoelectric actuator and method of manufacturing the same | 6 | 2009 |
current sensor | 6 | 2009 |
wafer level packaged optical subassembly and transceiver module having same | 6 | 2014 |