The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
systems and methods for intelligent discard in a communication network | 50 | 2009 |
bump structure and method of forming same | 38 | 2012 |
finfet device and method of fabricating same | 31 | 2013 |
fin field effect transistor (finfet) device and method for forming the same | 28 | 2014 |
lattice-mismatched semiconductor structures with reduced dislocation defect densities an… 🛈 | 27 | 2005 |
windowing for identifying shock outcome | 27 | 2013 |
method and apparatus for fabricating phosphor-coated led dies | 27 | 2012 |
protrusion bump pads for bond-on-trace processing | 26 | 2014 |
method to define multiple layer patterns using a single exposure | 24 | 2013 |
apparatus and method for power mos transistor | 21 | 2012 |