The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
alternating-current conversion system having low power consumption bleeder circuit | 6 | 2012 |
semiconductor structure and fabrication method thereof | 6 | 2008 |
fabrication method of trenched metal-oxide-semiconductor device | 6 | 2008 |
semiconductor package structure and manufacturing method thereof | 5 | 2016 |
power mosfet and method of fabricating the same | 5 | 2009 |
chip package structure and manufacturing method thereof | 5 | 2015 |
fan-out wafer level chip package structure and manufacturing method thereof | 5 | 2014 |
led driving circuit and power converting circuit | 4 | 2010 |
three-pin integrated synchronous rectifier and a flyback synchronous rectifying circuit | 4 | 2007 |
multiphase dc-to-dc converter | 4 | 2012 |