How many patents does
National Center For Advanced Packaging Co., Ltd. have?

patents
574
families
418
granted
144
applications
430
CN
558
US
12
WO
4

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The report contains ten-year analysis with the following sections

  • patent filing analysis
  • worldwide filing analysis
  • patent family analysis
  • application analysis
  • granted analysis
  • classification analysis
  • citation analysis

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National Center For Advanced Packaging Co., Ltd.
Top ten assignees appearing on patents

National Center For Advanced Packaging Co., Ltd.
The top ten patent families are

Title of patent family
(most common patent title)
Family
members
Filing
year
tsv backside reveal structure and exposing process 5 2013
method for flattening surface of substrate by adopting cmp in pinboard process 4 2014
optical communication device and assembly method thereof 4 2015
fan-out-type wafer level package method 4 2015
active optical adapter plate and optical interconnection module 4 2015
silicon through hole patch board wafer testing system and method 3 2014
heat radiation structure used for bga (ball grid array) package of high-power chip 3 2014
photo chip of backward scattering grating coupled packaging structure and manufacture me… 🛈 2 2015
flexible-substrate-based three-dimensional packaging heat-radiation structure and prepar… 🛈 2 2015
package stack heat radiating structure with recessed heat radiating plate base and manuf… 🛈 2 2015