The report contains ten-year analysis with the following sections
contact us for pricing
Check out our sample pages |
Many companies now available
Search to find companies of interest
read summary of their published patent
the company report contains more information
national center for advanced packa… 🛈 | 248 |
national center for advanced packa… 🛈 | 16 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
tsv backside reveal structure and exposing process | 5 | 2013 |
method for flattening surface of substrate by adopting cmp in pinboard process | 4 | 2014 |
optical communication device and assembly method thereof | 4 | 2015 |
fan-out-type wafer level package method | 4 | 2015 |
active optical adapter plate and optical interconnection module | 4 | 2015 |
silicon through hole patch board wafer testing system and method | 3 | 2014 |
heat radiation structure used for bga (ball grid array) package of high-power chip | 3 | 2014 |
photo chip of backward scattering grating coupled packaging structure and manufacture me… 🛈 | 2 | 2015 |
flexible-substrate-based three-dimensional packaging heat-radiation structure and prepar… 🛈 | 2 | 2015 |
package stack heat radiating structure with recessed heat radiating plate base and manuf… 🛈 | 2 | 2015 |