The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
networked three-dimensional printing | 27 | 2010 |
printed circuit board with integrated temperature sensing | 20 | 2012 |
three-dimensional printer tool systems | 15 | 2013 |
augmented three-dimensional printing | 13 | 2012 |
networked three-dimensional printing | 13 | 2010 |
three-dimensional printer with force detection | 13 | 2012 |
downloadable three-dimensional models | 13 | 2012 |
system for use with three-dimensional printer and method for using the same | 11 | 2014 |
color switching for three-dimensional printing | 11 | 2012 |
voice-controlled three-dimensional fabrication | 8 | 2012 |