The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
thermal interface material with thin transfer film or metallization | 16 | 2007 |
circuit assemblies including thermoelectric modules | 16 | 2011 |
electrically conductive porous material assemblies and methods of making the same | 15 | 2013 |
multi-band planar inverted-f (pifa) antennas and systems with improved isolation | 14 | 2011 |
methods for establishing thermal joints between heat spreaders or lids and heat sources | 14 | 2013 |
low-profile antenna assembly | 13 | 2010 |
compliant multilayered thermally-conductive interface assemblies and memory modules incl… 🛈 | 13 | 2009 |
thermal interface materials including thermally reversible gels | 12 | 2010 |
flame retardant, electrically conductive adhesive materials and related methods | 12 | 2013 |
electromagnetic interference shields and related manufacturing methods | 12 | 2007 |