The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
printed circuit board, mount structure thereof, and methods of producing these | 9 | 2011 |
wiring board and manufacturing method thereof | 7 | 2008 |
wiring board | 7 | 2013 |
wiring board and mounting structure using the same | 7 | 2012 |
wiring board | 6 | 2012 |
assembly of multi-pattern wiring substrate and method of assembling multi-pattern wiring… 🛈 | 6 | 2012 |
method for manufacturing wiring board | 5 | 2012 |
wiring board and method for manufacturing the same | 5 | 2013 |
antenna substrate | 5 | 2012 |
collective printed circuit board | 4 | 2010 |