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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
systems and methods for bonding semiconductor elements | 19 | 2013 |
ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrason… 🛈 | 15 | 2009 |
methods of forming wire interconnect structures | 14 | 2012 |
bond heads for thermocompression bonders, thermocompression bonders, and methods of oper… 🛈 | 13 | 2013 |
method of teaching eyepoints for wire bonding and related semiconductor processing opera… 🛈 | 12 | 2007 |
gas delivery system for reducing oxidation in wire bonding operations | 12 | 2008 |
methods and systems for aligning tooling elements of ultrasonic bonding systems | 11 | 2010 |
systems and methods for optimizing looping parameters and looping trajectories in the fo… 🛈 | 11 | 2009 |
conductive bumps, wire loops, and methods of forming the same | 10 | 2009 |
systems and methods for determining and adjusting a level of parallelism related to bond… 🛈 | 9 | 2013 |