How many patents does
Komico have?
patents
263
families
98
granted
54
applications
209
KR
106
WO
52
CN
29
US
19
JP
5
EP
2
RoW
50
Buy the report
The report contains ten-year analysis with the following sections
- patent filing analysis
- worldwide filing analysis
- patent family analysis
- application analysis
- granted analysis
- classification analysis
- citation analysis
contact us for pricing
- VAT will apply to UK companies
- EU companies must supply their VAT number
Check out our sample pages |
Find companies to compare
Many companies now available
companies
12,000+
patents
42 million
patent families
23 million
Search to find companies of interest
read summary of their published patent
the following tables are just extracts from the report
the company report contains more information
Komico
Top ten assignees appearing on patents
2009 - 2018
| komico | 221 |
| mico bio med company | 4 |
| mico | 4 |
| mico tn | 3 |
| sosul company | 2 |
| gaomeike company | 1 |
| mico c&c | 1 |
2009
| komico | 56 |
| mico tn | 3 |
| sosul company | 2 |
| gaomeike company | 1 |
| mico c&c | 1 |
2018
| komico | 4 |
Komico
The top ten patent families are
|
Title of patent family (most common patent title) |
Family members |
Filing year |
|---|---|---|
| aerosol coating method and plasma-resistant member formed thereby | 10 | 2013 |
| interior material for thin film deposition device and method for manufacturing same | 8 | 2014 |
| method for producing for a laminated ceramic base plate | 8 | 2009 |
| plasma resistant coating film and formation method therefor | 8 | 2015 |
| grounding structure, and heater and chemical vapor deposition apparatus having the same | 8 | 2009 |
| ion implanter, internal structure of ion implanter and method of forming a coating layer… 🛈 | 8 | 2007 |
| connecting material for a pipe-shaped solid oxide fuel cell, and pipe-shaped solid oxide… 🛈 | 7 | 2011 |
| unit for supporting a substrate and apparatus for processing a substrate having the same | 7 | 2007 |
| electrostatic chuck containing double buffer layer for reducing thermal stress | 7 | 2008 |
| lift pin, and wafer-processing apparatus comprising same | 7 | 2009 |