How many patents does
Jiangsu Changjiang Electronics Technology Company have?
patents
1,140
families
991
granted
109
applications
1,031
CN
1,092
US
19
WO
18
JP
4
RoW
7
Buy the report
The report contains ten-year analysis with the following sections
- patent filing analysis
- worldwide filing analysis
- patent family analysis
- application analysis
- granted analysis
- classification analysis
- citation analysis
contact us for pricing
- VAT will apply to UK companies
- EU companies must supply their VAT number
Check out our sample pages |
Find companies to compare
Many companies now available
companies
12,000+
patents
42 million
patent families
23 million
Search to find companies of interest
read summary of their published patent
the following tables are just extracts from the report
the company report contains more information
Jiangsu Changjiang Electronics Technology Company
Top ten assignees appearing on patents
2018
Jiangsu Changjiang Electronics Technology Company
The top ten patent families are
|
Title of patent family (most common patent title) |
Family members |
Filing year |
|---|---|---|
| packaging structure with basic islands and without pins at four sides and manufacturing … 🛈 | 6 | 2011 |
| barrel-plating four-side pinless packaging structure and manufacturing method thereof | 6 | 2011 |
| foundation island-free packaging structure without pins on four surfaces and manufacturi… 🛈 | 6 | 2011 |
| etching-before-packaging horizontal chip 3d system-level metal circuit board structure a… 🛈 | 6 | 2013 |
| etching-before-packaging three-dimensional system-level metal circuit board structure in… 🛈 | 6 | 2013 |
| no-exposed-pad ball grid array (bga) packaging structures and method for manufacturing t… 🛈 | 5 | 2011 |
| first-packaged and later-etched normal chip three dimension system-in-package metal circ… 🛈 | 5 | 2013 |
| packaging-after etching three-dimensional system-on-chip upright stacking packaging stru… 🛈 | 5 | 2013 |
| sequentially etched and plated lead frame structure with island prepacked plastic sealed… 🛈 | 5 | 2011 |
| first-packaged and later-etched three-dimensional flip-chip system-in-package structure … 🛈 | 4 | 2013 |