The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
semiconductor fabricating process | 4 | 2008 |
method of self-aligned silicon nitride overlying for the borderless contact hole of copp… 🛈 | 3 | 2006 |
image sensor | 3 | 2006 |
method for manufacturing gate structure | 2 | 2008 |
deposition doped polysilicon machine board | 2 | 2009 |
method for improving wafer-stage electromigration performance test | 2 | 2008 |
ion source with gas buffer balancing function | 2 | 2008 |
method for detecting wafer edge cleaning width of wafer | 2 | 2008 |
semiconductor structure with metal silicide and method for forming metal silicide | 2 | 2008 |
pipeline disassembly clamp | 2 | 2009 |