The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
pop package and manufacturing method thereof | 7 | 2009 |
stacked semiconductor package | 6 | 2010 |
stacked semiconductor package | 6 | 2010 |
integrated circuit device packages and methods for manufacturing integrated circuit devi… 🛈 | 5 | 2012 |
layered semiconductor package | 5 | 2010 |
stacked semiconductor package | 5 | 2010 |
metal core solder ball interconnector fan-out wafer level package and manufacturing meth… 🛈 | 5 | 2015 |
semiconductor package and method of manufacturing the same | 5 | 2015 |
method for manufacturing electronic component | 5 | 2013 |
memory card systems comprising flexible integrated circuit element packages, and methods… 🛈 | 5 | 2012 |