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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
anti-reductive high-frequency ceramic dielectric material sintered at low temperature an… 🛈 | 5 | 2009 |
ceramic dielectric material matched with nickel internal electrode and method for produc… 🛈 | 5 | 2009 |
film chip fuse and preparation method thereof | 3 | 2010 |
multilayer ceramic capacitor and preparation method thereof | 3 | 2012 |
method for manufacturing end electrode of sheet-type capacitor | 2 | 2008 |
ceramic dielectric material matched with nickel inner electrode | 2 | 2010 |
high-frequency and high-q-value chip multilayer ceramic capacitor | 2 | 2010 |
method for preparing high-precision and high-stability temperature control manganese zin… 🛈 | 2 | 2010 |
manufacturing method of inductor | 2 | 2010 |
preparation method of high voltage multilayer ceramic capacitor | 2 | 2009 |