The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
light emitting diode | 58 | 2015 |
package substrate and package structure using the same | 26 | 2015 |
light-emitting device | 12 | 2015 |
semiconductor structure | 10 | 2012 |
light emitting module | 10 | 2012 |
semiconductor light emitting structure and semiconductor package structure | 9 | 2013 |
thin-film flip-chip light emitting diode having roughening surface and method for manufa… 🛈 | 9 | 2014 |
method for manufacturing light emitting unit | 9 | 2014 |
light emitting diode device and flip-chip packaged light emitting diode device | 9 | 2011 |
nitride semiconductor structure and semiconductor light emitting device including the sa… 🛈 | 8 | 2012 |