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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for manufacturing a multi-layer circuit board | 8 | 2012 |
method for manufacturing printed circuit board with patterned electrically conductive la… 🛈 | 7 | 2012 |
inner substrate for manufacturing multilayer printed circuit boards | 6 | 2007 |
gummed copper foil, production method for same, multilayer flexible circuit board and pr… 🛈 | 6 | 2012 |
rigid-flexible combined board and method for manufacturing the same | 6 | 2013 |
method for manufacturing printed circuit board | 6 | 2012 |
method for manufacturing printed circuit board | 6 | 2012 |
method of manufacturing a printed circuit board with circuit visible | 6 | 2012 |
rigid-flexible circuit substrate, rigid-flexible circuit board and manufacturing method … 🛈 | 5 | 2012 |
electroplating apparatus | 5 | 2007 |