The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
led component by integrating epitaxial structure and package substrate together and meth… 🛈 | 11 | 2013 |
led and manufacturing method thereof and luminescent device | 10 | 2010 |
light emitting diode and manufacturing method thereof, light emitting device | 10 | 2010 |
light emitting diode and forming method thereof | 9 | 2010 |
light emitting diode and manufacturing method thereof | 8 | 2010 |
light emitting device and manufacturing method thereof | 8 | 2010 |
high-voltage inversion led chip and manufacturing method thereof | 8 | 2015 |
reversely-installed photonic crystal led chip and method for manufacturing same | 7 | 2012 |
light-emitting diode, package substrate structure and packaging method | 7 | 2014 |
lighting circuit | 7 | 2010 |