The report contains ten-year analysis with the following sections
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apic yamada corporation | 302 |
mighty card | 3 |
apic yamada corporation | 19 |
apic yamada corporation | 11 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
resin molding machine | 20 | 2010 |
method of manufacturing magnet-embedded core | 15 | 2016 |
method for resin molding and resin molding apparatus | 14 | 2011 |
molding die set and resin molding apparatus having the same | 14 | 2011 |
bonding apparatus and bonding method | 12 | 2011 |
rfid tag, wireless charging antenna part, method of manufacturing the same, and mold | 12 | 2011 |
resin sealing device | 11 | 2011 |
resist film forming device, conductive film forming and circuit forming device, electrom… 🛈 | 11 | 2012 |
compression molding method and device for light-emitting device reflector | 10 | 2011 |
resin molding method and resin molding die | 9 | 2014 |