The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
nozzle for stress-free polishing metal layers on semiconductor wafers | 10 | 2012 |
method and apparatus for uniformly metallization on substrate | 9 | 2013 |
method and apparatus for cleaning semiconductor wafer | 8 | 2012 |
apparatus and method for plating and/or polishing wafer | 8 | 2013 |
washing hydrogen water producing method and producing apparatus | 8 | 2015 |
methods and apparatus for cleaning semiconductor wafers | 8 | 2008 |
methods and apparatus for cleaning semiconductor wafers | 8 | 2009 |
methods and apparatus for cleaning flip chip assemblies | 7 | 2011 |
apparatus and method for cleaning semiconductor wafer | 7 | 2014 |
coater with automatic cleaning function and coater automatic cleaning method | 7 | 2014 |