The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
apparatus for manufacturing semiconductor devices | 25 | 2010 |
method for molecular adhesion bonding at low pressure | 19 | 2010 |
relaxation of strained layers | 19 | 2008 |
semiconductor on glass substrate with stiffening layer and process of making the same | 17 | 2010 |
fabrication of substrates with a useful layer of monocrystalline semiconductor material | 16 | 2000 |
methods for producing improved epitaxial materials | 16 | 2007 |
methods of forming iii/v semiconductor materials, and semiconductor structures formed us… 🛈 | 16 | 2011 |
electronic device for radiofrequency or power applications and process for manufacturing… 🛈 | 16 | 2010 |
method for manufacturing a semiconductor-on-insulator structure having low electrical lo… 🛈 | 16 | 2009 |
metallic carrier for layer transfer and methods for forming the same | 16 | 2011 |