The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
integrated circuit including vertical diode | 8 | 2008 |
semiconductor package and method of attaching semiconductor dies to substrates | 8 | 2007 |
current constricting phase change memory element structure | 8 | 2007 |
integrated circuit having a semiconductor substrate with a barrier layer | 8 | 2007 |
solder contacts and methods of forming same | 7 | 2008 |
integrated circuit including doped semiconductor line having conductive cladding | 7 | 2007 |
method of fabricating an integrated circuit using two mask layers | 6 | 2007 |
manufacturing method for forming an integrated circuit device and corresponding integrat… 🛈 | 6 | 2007 |
integrated circuit including electrode having recessed portion | 6 | 2008 |
memory cell having improved mechanical stability | 6 | 2008 |