The report contains ten-year analysis with the following sections
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phoenix pioneer technology company | 249 |
phoenix | 4 |
phoenix pioneer technology company | 48 |
phoenix | 4 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
package apparatus and manufacturing method thereof | 10 | 2014 |
package method | 8 | 2014 |
package substrate and its fabrication method | 7 | 2014 |
package structure and method of manufacturing the same | 7 | 2014 |
package structure and its fabrication method | 7 | 2014 |
package board, flip-chip package circuit and manufacturing method thereof | 6 | 2014 |
interposer substrate and method of manufacturing the same | 6 | 2014 |
interposer substrate and method of fabricating the same | 6 | 2014 |
packaging substrate and manufacturing method therefor | 6 | 2015 |
package substrate and flip-chip package circuit including the same | 6 | 2014 |