The report contains ten-year analysis with the following sections
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megica corporation | 372 |
qualcomm | 25 |
megit acquisition corporation | 12 |
megic corporation | 2 |
etron technology | 1 |
megit acquistion corporation | 1 |
ma.gi.c.a. | 1 |
miji electronic company | 1 |
qualcomm | 2 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
top layers of metal for high performance ic's | 32 | 1998 |
circuit structure and fabrication method thereof | 21 | 2005 |
post passivation interconnection schemes on top of ic chip | 20 | 2000 |
integrated circuit chip using top post-passivation technology and bottom structure techn… 🛈 | 15 | 2009 |
system-in packages | 13 | 2009 |
image and light sensor chip packages | 13 | 2009 |
system-in packages | 12 | 2009 |
high performance sub-system design and assembly | 11 | 1999 |
circuit assembly structure and method for making the same | 11 | 2005 |
chip packages with power management integrated circuits and related techniques | 10 | 2008 |